wafer test

The wafer level packaging ( WL-CSP) technologies and their application progresses, which including the key technologies of WL-CSP, the package test description, the observation method and the reliability the analyses of WL-CSP are summarized.

综述了圆片级芯片尺寸封装（WL-CSP）的新技术及其应用概要，包括WL-CSP的关键工艺技术、封装与测试描述、观测方法和WL-CSP技术的可靠性及其相关分析等。

Abstract The on-wafer testing system with microwave probe has been made and used to test the GaAs high-speed dynamic frequency divider chips on wafer.

本文研制出多触头微波探针，建立了微波探针在片检测系统.针对GaAs高速集成电路&动态分频器电路芯片进行了在片测试和筛选。

WAT ( Wafer Acceptance Test ) is a very important stage of process.

WAT ( waferacceptancetest ) 是芯片制造过程中重要的测量站点.

Through the reliability test, the NTC CUP process is suitable for thinner bond wire. So we can reduce the cost of the product which is lower driving current through wafer process change.

通过可靠性试验的研究发现，NTC的CUP工艺，在目前情况下只适用于线径较细的焊接工艺，因而可以对一些驱动电流较低的产品进行芯片工艺改进，降低芯片成本。

X-rays, as a new radiation source, has the advantages such as safety, precise control of dose rate, strong intensity, possibility of wafer-level test or even on-line test, which greatly reduce cost for package, test and transportation.

X射线作为辐射源具有安全、剂量率控制准确等优点，可进行硅片级的测试甚至在线测试，从而大大降低封装、测试、运输的成本，提高研发效率。